document number: 61026 revision 07-aug-01 www.vishay.com 56 BCM vishay electro-films chip resistors vishay electro-films ?france +33.4.93.37.28.24 fax: +33.4.93.37.27.31 ?germany +49.9287.710 fax: +49 9287.70435 ?israel +9 72.3.557.0945 fax: +972.3.558.9121 ?italy + 39.2.300.11911 fax: +39.2.300.11999 ?japan +81.42.729.0661 fax: +81.42.729.3400 ?singapore +65.788.6668 fax: +65. 788.0988 ?sweden +46.8.594.70590 fax: +46.8.594.70581 ?uk +44 191 514 8237 fax: +44 1953 457 722 ?usa: (401) 738-9150 fax: (401) 738 -4389 derating curve standard value retma chart tolerance 10% 20% 10 33 10 12 39 15 15 47 22 18 56 33 22 68 47 27 82 68 percent of ra ted power - 65 c70 c - 75 - 50 -25 0 25 50 75 100 125 150 175 miniature back-contact resistor chip features only one wire bound required small size: 0.015 inches square single top contact resistance range: 100 ? to 100k ? (see standard retma chart) tolerance: 10%, 20%, 25%, 50% packaging: matrix tray parameter tcr 250ppm/ c noise, mil-std-202, method 308 - 20db typical moisture resistance, mil-std-202 method 106 0.5% maximum ? r/r stability, 1000 hours, 125 c, 50mw 1.0% maximum ? r/r thermal shock, mil-std-202, method 107, test condition f 0.5% maximum ? r/r high temperature exposure, + 150 c, 100 hours 0.25% maximum ? r/r insulation resistance (open resistor) 10 12 minimum operating voltage 100v maximum power rating at + 70 c (see derating curve) 100mw 5 x rated power short-time overload, + 25 c, 5 seconds 0.5% maximum ? r/r standard electrical specifications 75 50 25 the BCM series are the smallest single value chips available from vishay efi. one wire bond only, they are intended for loose tolerance commercial applications. the BCMs are manufactured using vishay electro-films (efi) sophisticated thin film equipment and manufacturing technology. the BCMs are 100% electrically tested and visually inspected to vishay efi s commercial criteria. 100 product may not be to scale
www.vishay.com 57 BCM vishay electro-films document number: 61026 revision 07-aug-01 chip resistors vishay electro-films ?france +33.4.93.37.28.24 fax: +33.4.93.37.27.31 ?germany +49.9287.710 fax: +49 9287.70435 ?israel +9 72.3.557.0945 fax: +972.3.558.9121 ?italy + 39.2.300.11911 fax: +39.2.300.11999 ?japan +81.42.729.0661 fax: +81.42.729.3400 ?singapore +65.788.6668 fax: +65. 788.0988 ?sweden +46.8.594.70590 fax: +46.8.594.70581 ?uk +44 191 514 8237 fax: +44 1953 457 722 ?usa: (401) 738-9150 fax: (401) 738 -4389 parameter chip size 0.015 x 0.015 0.002 (0.381 x 0.381 0.05mm) chip thickness 0.008 0.003 (0.203 0.08mm) chip substrate material silicon resistor material tantalum nitride, self-passivating bonding pad size 0.0038 square minimum - 0.004 square typical number of pads 1 top pad material aluminum, 10k? thick backing 3k? minimum gold mechanical specifications in inches configurations in inches miniature back-contact resistor chip example: 100% visualled, 100k ? , 10%, 250ppm/ c tcr, aluminum pads, commercial inspection. p/n: w BCM 000 1000 2 k inspection product process resistance multiplier tolerance /packaging family code value code code w = 100% visually see process code use first 4 b = 0.01 k = 10% inspected parts in matrix table significant digits a = 0.1 m = 20% trays per mil-std-883 of resistance 0 = 1 l = 25% x = sample, visually 1 = 10 n = 50% inspected loaded in matrix 2 = 100 trays (4% aql) ordering information 0.004 0.015 0.004 0.015 schematic bond pad back of chip typical range 821 ? - 100k ? typical range 100 ? - 820 ?
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